At Mobile World Congress 2019, Qualcomm has announced the new QCA6390, their new System-on-a-chip (SoC) that will bring WiFi 6 and Bluetooth 5.1 support. The new 14nm SoC will bring significant power consumption reductions over previous chips and will be fully WiFi 6 compatible. The WiFi Alliance announced WiFi 6 last year and it is already seeing wide adoption in the market. WiFi 6 supports the new 802.11ax standard and is a simplified naming convention.
Qualcomm states that the new QCA6390 SoCo will support 8×8 MU-MIMO and will support a wide range of security standards including Wi-Fi Security protocol (WPA-3). That includes WPA3-Personal, WPA3-Enterprise, WPA3-Enhanced Open and WPA3-Easy Connect. It will have nearly 1.8Gbps throughput and because of its 14nm design, it is reported to be 50% better at power consumption over competitors.
The success of the QCA6390 in some ways is a foregone conclusion. The San Diego, California chip manufacture has strong manufacture ties with the likes of Microsoft and Verizon. Consumer demand for always-on, high speed devices continues to grow and that makes this chip an easy way to make it happen for manufactures. Don’t be surprised if other manufactures start picking up this chip for their laptops and mobile devices throughout 2019.